Has Hybrid Bonding Hit a Wall?

According to South Korean media reports, Taiwan’s TSMC() is expected to continue using existing microbump packaging technology for the time being in advanced packaging that combines high-bandwidth memory (HBM) with AI accelerators, rather than switching to hybrid bonding. Given material development cycles, finer microbumps are expected to remain in use through late-generation HBM4 and into early HBM5 products.