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Narrated on Storyflo

chippub

50 narrated episodes · Oct 5, 2026 – Nov 8, 2026

Originally published at chippub.substack.com

chippub is available as narrated audio on Storyflo. 50 episodes have been narrated, most recently on November 8, 2026. The writing is originally published at chippub.substack.com. Every episode links back to the article it was read from.

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Nvidia Becomes the Leader in Networking Chips
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Episodes

  1. Nvidia Becomes the Leader in Networking Chips
    Nov 8, 2026
  2. Is Nvidia Eyeing Teflon?
    Nov 6, 2026
  3. Micron's Latest DRAM and NAND Roadmap
    Nov 5, 2026
  4. The Battle for Packaging Substrates
    Nov 4, 2026
  5. Lumentum's Stunning Comeback!
    Nov 3, 2026
  6. Diamonds to the Rescue of Chips!
    Nov 2, 2026
  7. Silicon Carbide Industry Sheds Players
    Nov 1, 2026
  8. Optical Chips: An Inflection Point Is Here!
    Oct 30, 2026
  9. PCB: Fire and Ice
    Oct 29, 2026
  10. CPO Isn't the End: Optical Interconnect's Real Goal
    Oct 28, 2026
  11. Chip Manufacturing Landscape Rewritten!
    Oct 27, 2026
  12. CoPoS Is Here: Packaging Has Changed!
    Oct 26, 2026
  13. Transistors Beyond 1nm: The Four-Way Race
    Oct 25, 2026
  14. Panel-Level Packaging: The Problems Begin
    Oct 23, 2026
  15. Nvidia's Move: Four-Way CPU Battle
    Oct 22, 2026
  16. Is NVIDIA Also Entering the 3D DRAM Market?
    Oct 21, 2026
  17. NVIDIA Executive Asserts: The CPU Has Changed!
    Oct 20, 2026
  18. 3D NAND Hits 1000 Layers: What's Next?
    Oct 19, 2026
  19. Equipment Giants Vie for Advanced Packaging
    Oct 18, 2026
  20. TSMC's Results Hit a New High Again
    Oct 16, 2026
  21. Intel Packaging, Latest Roadmap
    Oct 15, 2026
  22. 0.7nm Chip, a New Milestone, a Global First!
    Oct 14, 2026
  23. Titans Snap Up DRAM
    Oct 14, 2026
  24. World's Thinnest Gallium Nitride Chip, Made by Intel
    Oct 14, 2026
  25. WiFi 8 Has Changed!
    Oct 14, 2026
  26. Apple Silicon: A Successful Disruption
    Oct 14, 2026
  27. Advanced Packaging: Rapid Capacity Expansion
    Oct 14, 2026
  28. Samsung's Bold Gamble on Silicon Photonics
    Oct 14, 2026
  29. AI Chips, a New Melee
    Oct 14, 2026
  30. Major Changes Coming to Apple's Face ID
    Oct 14, 2026
  31. The Tipping Point for Panel-Level Packaging?
    Oct 14, 2026
  32. Tech Giants Are All Grabbing Up Chips
    Oct 14, 2026
  33. ASML: EUV Memory Orders Overtake Logic for First Time
    Oct 14, 2026
  34. Deconstructing NVIDIA's Silicon Photonics Roadmap
    Oct 14, 2026
  35. Intel, Ready to Take Off?
    Oct 14, 2026
  36. TSV, Too Hard
    Oct 14, 2026
  37. 0.2nm Chip Roadmap Revealed for the First Time
    Oct 14, 2026
  38. The Real Bottleneck of Optical Chips
    Oct 14, 2026
  39. How GlobalFoundries, Tower & UMC Won the AI Era
    Oct 14, 2026
  40. TSMC Charts the Next Generation of Chips
    Oct 14, 2026
  41. Intel, Betting Right Again?
    Oct 14, 2026
  42. A Revolutionary AI Chip
    Oct 14, 2026
  43. Indium Phosphide: A Massive Shortage!
    Oct 13, 2026
  44. Glass Substrates Catch Up
    Oct 12, 2026
  45. Copper and Light: Broadcom's Latest Sharing!
    Oct 11, 2026
  46. Nvidia to Invest in AI Chip Company d-Matrix
    Oct 9, 2026
  47. Samsung's Profit Soars 782%, Earning 5.9 Billion Yuan a Day
    Oct 8, 2026
  48. 0.3nm Chip Roadmap
    Oct 7, 2026
  49. CPO Explained: Co-Packaged Optics
    Oct 6, 2026
  50. Large Models Are Changing EDA
    Oct 5, 2026

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