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The Battle for Packaging Substrates

Meng Li · chippub

Nov 4, 2026 · 1 min listen · Last updated November 4, 2026

Packaging substrates were once an unremarkable part of the semiconductor supply chain. Now, riding the AI wave, they have become a hotly contested resource. As demand for AI chips keeps climbing and advanced packaging capacity expands, substrate supply is tightening, and lead times and capacity are drawing the industry’s attention.

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Packaging substrates were once an unremarkable part of the semiconductor supply chain. Now, riding the AI wave, they have become a hotly contested resource.

As demand for AI chips keeps climbing and advanced packaging capacity expands, substrate supply is tightening, and lead times and capacity are drawing the industry’s attention. A Counterpoint Research report released in March 2026 projects that, driven by AI demand and the growing complexity of high-end products, the ABF substrate supply-demand gap could reach about 20%, with new capacity not coming online until 2027.

The change is not driven by demand growth alone. GPUs, ASICs and HBM are now integrated into the same package, which requires higher-density interconnects between chips and makes power delivery, signal transmission and thermal design inside the package more complex. Traditional organic substrates face challenges in size, flatness, and fine-line capability, so glass core substrates have drawn attention.

However, glass is not the only answer. Silicon interposers, silicon bridges and RDL each serve different packaging architectures and performance needs. TSMC, Intel, Samsung Electro-Mechanics, ASE, and others are advancing along different technology routes.

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The Battle for Packaging Substrates · Storyflo