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Is NVIDIA Also Entering the 3D DRAM Market?

Meng Li · chippub

Oct 21, 2026 · 1 min listen · Last updated October 21, 2026

According to Korean media reports, Groq, the AI semiconductor company that has effectively been acquired by Nvidia, plans to apply a three-dimensional stacked DRAM packaging technology to its next-generation chips.

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According to Korean media reports, Groq, the AI semiconductor company that has effectively been acquired by Nvidia, plans to apply a three-dimensional stacked DRAM packaging technology to its next-generation chips. The move is being read as an attempt by Groq to significantly increase chip capacity by moving away from its current SRAM-centric chip design (SRAM is fast but small in capacity).

The approach Groq is adopting is called 3DS (3D Stacked memory). 3DS is a high-capacity package that uses through-silicon vias (TSVs) to vertically connect DRAM dies. Although it resembles high-bandwidth memory (HBM) in using TSVs, unlike HBM, which focuses on data transfer speed, 3DS focuses on expanding capacity while retaining the existing DRAM interface.

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Is NVIDIA Also Entering the 3D DRAM Market? · Storyflo