In 2026, the optical chip industry is entering a new wave of growth.
Recently, global semiconductor giants have been making frequent moves.
In mid-October, Intel() showcased its latest progress in silicon photonics at the OCP Global Summit, focusing on integrating InP lasers with 300mm silicon photonics wafers. Samsung is also picking up the pace, planning to launch a silicon photonics foundry service in 2027. UMC announced an additional capital expenditure of about $3.2 billion, naming silicon photonics as one of its key expansion areas.
Meanwhile, Tower Semiconductor has already landed concrete orders. In May this year, Tower announced a silicon photonics customer contract corresponding to $1.3 billion in revenue for 2027, and in September it announced that its laser-integrated photonic chips for 800G to 1.6T had begun high-volume shipments.
It is not only the manufacturing side that is buzzing; the application side is stirring too. Since the start of this year, NVIDIA’s Spectrum-X CPO switches and Broadcom’s 51.2T Bailly CPO switches have entered limited-volume shipments one after another, meaning that co-packaged optics (CPO), a much-watched technology, is gradually leaving the lab and entering real commercial use.