Tech
Intel, Betting Right Again?
Meng Li · chippub
Oct 14, 2026 · 1 min listen · Last updated October 14, 2026
“People used to doubt whether glass substrates could withstand the stresses generated during the packaging process, but now the technical stability has been secured,” said Yoo Dong-soo, head of the R&D team at Amkor Technology’s Korea R&D Center, at a recent sharing session.
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Intel, Betting Right Again?
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