World's Thinnest Gallium Nitride Chip, Made by Intel

Intel Foundry researchers have demonstrated a groundbreaking gallium nitride (GaN) chip technology based on 300-millimeter silicon wafers, marking a significant leap forward in semiconductor design. The achievement, presented at the 2025 IEEE International Electron Devices Meeting (IEDM), addresses one of the most pressing challenges in modern computing: delivering greater performance, higher speeds, and improved efficiency within increasingly compact spaces.