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Panel-Level Packaging: The Problems Begin

Meng Li · chippub

Oct 23, 2026 · 1 min listen · Last updated October 23, 2026

Shifting advanced packaging from wafers to panels looks, at first glance, like a simple geometry problem. Packages for large AI and HPC chips are increasingly rectangular, while the 300mm wafer beneath them remains round.

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Shifting advanced packaging from wafers to panels looks, at first glance, like a simple geometry problem. Packages for large AI and HPC chips are increasingly rectangular, while the 300mm wafer beneath them remains round. As packages grow, more and more expensive processing steps land in the edge regions of the round wafer, which cannot actually be used to make any usable product.

Panels “recover” this wasted area. In the same process cycle, a panel can hold more large package units, and unlike a wafer, the panel’s dimensions do not impose the same strict limits on square or rectangular package specifications. For ever-larger advanced packages, this economic benefit cannot be ignored.

However, the semiconductor packaging industry has spent decades focused on wafer processing, not panel processing. Existing equipment, materials, process recipes, handling systems, and process control schemes were all developed around the geometry and mechanical characteristics of round workpieces.

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Panel-Level Packaging: The Problems Begin · Storyflo