Singapore startup Nexstrom announced on September 22, 2026, that it has closed a $12 million seed round led by Xora Innovation. The funds will be used to commercialize its “North Star” tool, which is designed to grow two-dimensional semiconductor materials—transition metal dichalcogenides (TMDs)—directly onto 300 mm (12-inch) wafers.
In June 2026, , TSMC(), and imec demonstrated the integration of two-dimensional transistors on 300 mm wafers. In that work, however, the channels were grown on a separate substrate and then transferred onto the wafer. Whether high-quality films that meet the requirements of high-volume manufacturing can be grown directly on the wafer is the question Nexstrom is trying to answer. Comparing the company’s documents with statements from management reveals inconsistencies in how the target timeline is described: whether the goal has already been “achieved on 300 mm wafers,” or whether it is only “planned for completion by the end of October.”